Huatian Technology's Fan-Out Packaging Tackles the Chip Thermal-Failure Challenge
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来源：Pandaily发布时间待核实
Research suggests more than half of electronic product failures stem from thermal failures caused by rising chip junction temperature. As transistor density climbs, power density and heat grow, making package thermal design a key bottleneck. Huatian Technology has built a full-process thermal design and simulation capability in fan-out packaging to address heat at the source.